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Thursday, 29 July 2010
Technology Focus PDF Print E-mail

EMERGING TECHNOLOGY GROUP

Application, Process and Technology Development

  •     High Density Printed Circuit Board Processing: Military, Medical, Next Generation Communications and Automotive

  •     PV Solar / Flexible Solar Cell Panel: PCB Panel Substrate for PV Solar Tiling Packaging, Thin Film Patterning, Etching

  •     Radio Frequency Identification Tags (RFID): Pad Drilling and Thin Film Patterning

  •     Touch Screen and Display: Thin Film Patterning, ITO, Glass Panel, Polyester Panel

  •     Critical Medical Device and Diagnostics: Thin Films (Patterning), Critical Drug Delivery (Drilling) and Micro fluidics

High Volume Production System Solutions

  •     Automated Panel Format Systems: Printed Circuit Board Drilling, Automated Board Handling, Micro Hole Drilling, Modular Station Systems For Scalable Growth In New Markets

  •     Large Panel Format Systems: Large Printed Circuit Boards, Glass Panel and Wide Format Web (Drilling, Thin Film Patterning)

  •     Roll to Roll Format Systems: Flex Circuits, Medical Diagnostic Disposable Devices, RFID

  •     Process Technology:

LASERS

  •     UV Lasers (DPSS & Excimer 193 nm, 248nm, 266nm, 308 nm and 355 nm)
  •     IR & Visible Lasers (Far IR CO2 9.6 & 10.6 µm, DPSS 532nm & 1064nm, Fiber Lasers (1070nm & 1080 nm),  Femto Second Lasers)

MECHANICAL

  •     Mechanical Drilling (Down to <Ø75 µm)
  •     Mechanical Routing (Through Slots and Blind Milling of Precision Depth Pockets)
  •     High Aspect Ratio Drilling (Front to Back Alignment)

 


 

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